ULB100 技术规格书

产品概述

ULB100模组是楷客科技采用STM32WL系列SOC芯片自主研发的支持自组网协议的LoRa模组,具有非常丰富的外设,包含26个GPIOs, UART, I2C, SPI, ADC, PWM等等,并且具有超低的功耗和超小的尺寸,该模组是为满足物联网项目对于稳定可靠通讯的需求而设计,特别适合应用于诸如智慧城市、智能家居、跟踪定位以及工业物联网等多个领域。目前ULB100已经支持LoRaWAN、亚马逊Sidewalk、P2P、KK-Link自组网等多种协议栈。另外,ULB100也兼容Zephyr RTOS操作系统,特别适合开发者和无线发烧友集成到他们的产品中进行二次开发。

订购信息

模块

Part NumberOperating BandOutput Power
ULB100LBLPLow Band 434MHz/470MHz~510MHz with High efficiency PA14dBm
ULB100HBLPHigh Band 868MHz/902MHz~928MHz with High efficiency PA14dBm
ULB100LBHPLow Band 434MHz/470MHz~510MHz with High power PA22dBm
ULB100HBHPHigh Band 868MHz/902MHz~928MHz with High power PA22dBm

开发板

Part NumberOperating BandOutput Power
EULB100LBLPEVK of ULB100LBLP, Low Band 434MHz/470MHz~510MHz14dBm
EULB100HBLPEVK of ULB100HBLP, High Band 868MHz/902MHz~928MHz14dBm
EULB100LBHPEVK of ULB100LBHP, Low Band 434MHz/470MHz~510MHz22dBm
EULB100HBHPEVK of ULB100HBHP, High Band 868MHz/902MHz~928MHz22dBm

邮箱:contact@cactes.com

特点

  • MCU及片上存储
    • ARM® Cortex-M4处理器,主频48MHz
    • Up to 256kB flash和64 kB RAM
  • LoRa
    • -138dBm@300bps接收灵敏度
    • 支持14dBm高效率发射(20mA发射电流)和22dBm高功率发射(120mA发射电流)
    • 支持LoRa Point-to-Point (P2P)通信方式
    • 支持LoRaWAN 1.0.4全球协议栈,
      • OTAA/ABP
      • CN470, IN865, EU868, AU915, US915, KR920, RU864, and AS923
    • 支持亚马逊Sidewalk协议栈
    • 支持楷客科技即插即用自组网协议栈KK-Link
  • 基于串口的AT指令接口
  • 丰富的外设接口,26 x GPIOx/USB/UART/SPI/I2C/PWM/ADC
  • 2.0uA 超低功耗(可接收串口数据,可 RTC 唤醒)
  • 超小尺寸 12.2 x 13.2 x2.5mm
  • 工作条件:
    • 工作电压1.8V to 3.6V
    • 工作温度-40 to +85℃

应用

  • 智能穿戴
  • 智能家居
  • 人员及资产定位跟踪
  • 无线传感终端
  • 工业控制
  • 智能抄表
  • 智慧农业

image-20230810102711424

硬件原理框图

image-20230810103056890

管脚说明

管脚布局

image-20230810103153732

管脚定义

ULB100模组共有54个管脚,详细管脚定义如下表所示。

No.NameTypeFunction
1PB4I/O/TMCU GPIO
2PB5I/O/TMCU GPIO
3PB6I/O/TMCU GPIO
4PB7I/O/TMCU GPIO
5PB8I/O/TMCU GPIO
6PA0I/O/TMCU GPIO
7PA1I/O/TMCU GPIO
8PA2I/O/TLPUART1_RX from MCU
9GNDPGround
10ANTANTLoRa Antenna Port
11PA3I/O/TLPUART1_TX from MCU
12PA4I/O/TMCU GPIO
13PA5I/O/TMCU GPIO
14GNDPGround
15PA6I/O/TMCU GPIO
16PA7I/O/TMCU GPIO
17PA8I/O/TMCU GPIO
18PA9I/O/TMCU GPIO
19NRSTIMCU Reset Pin,Active Low
20BOOT0IMCU GPIO
21PB0I/O/TMCU GPIO
22PB2I/O/TMCU GPIO
23PB12I/O/TMCU GPIO
24PA10I/O/TMCU GPIO
25PA11I/O/TMCU GPIO
26PA12I/O/TMCU GPIO
27NC-No connection
28GNDPGround
29VDDPPower supply
30GNDPGround
31PC13I/O/TMCU GPIO
32PA13I/O/TSWDIO of SWD for program download
33PA14I/O/TSWCLK of SWD for program download
34PA15I/O/TMCU GPIO
35NC-No connection
36GNDPGround
37NC-No connection
38NC-No connection
39PB3I/O/TMCU GPIO
40GNDPGround

P: power supply; I: input; O: output; T: high impedance; ANT: antenna port.

电气性能指标

极限工作条件

高于下表所列出的绝对最大额定值的应力可能会对模组造成永久性损坏,或长时间暴露于绝对最大额定条件可能会影响设备的可靠性。

SymbolParameterMinMaxUnit
VDDPower supply voltage-0.33.9V
VINI/O pin voltage-0.33.9V
Pin_LoRaRF input level@ANT_LoRa-0dBm
TAOperating Temperature-4085
TStoreStorage Temperature-65150

建议工作条件

SymbolParameterMinTypeMaxUnit
VDDPower supply voltage1.83.33.6V
VINI/O input voltage-0.33.33.6V
TAOperating Temperature-402585

技术规格

ModelULB100LBLP/ULB100HBLP/ULB100LBHP/ULB100HBHP
Platform Configurations
MCUARM® Cortex®-M4 32-bit processor, 48 MHz internal clock
MCU Flashup to 256KB
RAMup to 64kB
System
MCU OSZephyr RTOS
Wireless
LoRaLoRaWAN 1.0.4, Sidewalk, KK-Link, P2P, Private LoRa
RF Characteristic
TXOPULB00LBLP/ULB100HBLP: 15dBm maximum ULB00LBHP/ULB100HBHP: 22dBm maximum
Sensitivity-138dBm@SF12/125kHz, LoRa
-125dBm@SF7/125kHz, LoRa
-117dBm@4.8kbps, FSK
-108dBm@38.4kbps, FSK
Data ratesSpreading Factor from SF12 to SF5; Bandwidth from 125kHz to 250kHz
Power Consumption
Power Supply3.3V
Current@sleep mode2.35uA
Current@Standby mode1.05mA
Current@LoRa TransmittingULB100LBLP: 22.5mA@14dBm
ULB100HBLP: 23.5mA@14dBm
ULB100LBHP: 110mA@22dBm
ULB100HBHP: 120mA@22dBm
Current@LoRa Receiving5.5mA
Interface
GPIO x26
UART x2 LPUART x1
I2C x3
SPI x2
ADC x9
PWM
Environment
Operating Temperature-40~85℃
Humidity5%~ 95% RH
Mechnaical
Size12.213.22.5mm
Weight1g

射频性能测试

测试条件,VDD=3.3V,Ta=25℃。

ULB100LBLP 性能测试

ULB100LBLP TXOP@14dBm/470MHz

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ULB100LBLP TXOP@14dBm/500MHz

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ULB100LBLP Spurs@14dBm/470MHz

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ULB100LBLP Spurs@14dBm/500MHz

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ULB100LBLP TXOP vs Current@470MHz

image-20230810104800741

ULB100LBLP TXOP vs Current@500MHz

image-20230810104837537

ULB100HBLP性能测试

ULB100HBLP TXOP@14dBm/868MHz

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ULB100HBLP TXOP@14dBm/915MHz

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ULB100HBLP Spurs@14dBm/868MHz

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ULB100HBLP Spurs@14dBm/915MHz

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ULB100HBLP TXOP vs Current@868MHz

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ULB100HBLP TXOP vs Current@915MHz

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ULB100LBHP性能测试

ULB100LBHP TXOP@22dBm/470MHz

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ULB100LBHP TXOP@22dBm/500MHz

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ULB100LBHP Spurs@22dBm/470MHz

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ULB100LBHP Spurs@22dBm/500MHz

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ULB100LBHP TXOP vs Current@470MHz

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ULB100LBHP TXOP vs Current@500MHz

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ULB100HBHP性能测试

ULB100HBHP TXOP@14dBm/868MHz

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ULB100HBHP TXOP@22dBm/915MHz

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ULB100HBHP Spurs@14dBm/868MHz

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ULB100HBHP Spurs@22dBm/915MHz

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ULB100HBHP TXOP vs Current@868MHz

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ULB100HBHP TXOP vs Current@915MHz

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物理尺寸

外观3D图:

img

俯视图:

image-20230810110837959

侧视图:(厚度=2.5mm)

img

PCB封装建议

image-20230810111004755

存储和焊接

储存

模组长时间保存应密封在防潮袋(MBB)中,置于非冷凝的大气环境中,保持<40°C和90%RH的环境。模块的湿度敏感度等级(MSL)为3。

开箱后,模块必须在工厂条件为25±5°C和相对湿度60%的环境中放置。如果不满足上述条件,则需要对模块进行烘焙。

ESD

  • Human body model (HBM): ±2000 V

  • Charged-device model (CDM): ±500 V

回流焊

ULB100模组回流焊温度曲线图:

img